Figure 12. Surface profile of etched 120 μm deposited wafer after 1 hour of RIE

From

Etching Techniques for Thinning Silicon Wafer for Ultra Thin High Efficiency Interdigitated Back Contact Solar Cells

Iduabo John Afa, Gema López, Pablo Rafael Ortega Villasclaras

Journal of Optoelectronics Engineering. 2015, 3(1), 7-14 doi:10.12691/joe-3-1-2