Figure 16. (a) Surface profiles of total wafer thickness (b) Surface profile of extra 10 μm etch into supporting substrate

From

Etching Techniques for Thinning Silicon Wafer for Ultra Thin High Efficiency Interdigitated Back Contact Solar Cells

Iduabo John Afa, Gema López, Pablo Rafael Ortega Villasclaras

Journal of Optoelectronics Engineering. 2015, 3(1), 7-14 doi:10.12691/joe-3-1-2