Figure 15. Surface profiles of two sides of etched 40 μm deposited wafer after 2 hours of RIE

From

Etching Techniques for Thinning Silicon Wafer for Ultra Thin High Efficiency Interdigitated Back Contact Solar Cells

Iduabo John Afa, Gema López, Pablo Rafael Ortega Villasclaras

Journal of Optoelectronics Engineering. 2015, 3(1), 7-14 doi:10.12691/joe-3-1-2