Figures index

From

The Methodology for Realization of Smartphone Drop Test Using Digital Image Correlation

Martin Hagara, Róbert Huňady, Pavol Lengvarský, Jozef Bocko

American Journal of Mechanical Engineering. 2016, 4(7), 423-428 doi:10.12691/ajme-4-7-35
  • Figure 1. The high-speed digital image correlation system Q-450 Dantec Dynamics
  • Figure 2. The smartphone type Nokia 500 RM-750 used for experiment
  • Figure 3. The speckle pattern created on the analyzed smartphone surface
  • Figure 4. Configuration of the cameras with testing stand
  • Figure 5. Five investigated types of smartphone impacts to the ground
  • Figure 6. Calibration parameters used by the experiments
  • Figure 7. Virtual gages created on the evaluated smartphone surface
  • Figure 8. Temporal change of touchscreen deformation along the line gage in z direction by the impact of type A
  • Figure 9. Temporal change of touchscreen deformation along the line gage in z direction by the impact of type B
  • Figure 10. Temporal change of touchscreen deformation along the line gage in z direction by the impact of type C
  • Figure 11. Temporal change of touchscreen deformation along the line gage in z direction by the impact of type D
  • Figure 12. Temporal change of touchscreen deformation along the line gage in z direction by the impact of type E
  • Figure 13. The impact of the second corner occurring in the impact type E
  • Figure 14. Course of Von Mises stress obtained in impact type A
  • Figure 15. Course of Von Mises stress obtained in impact type B
  • Figure 16. Course of Von Mises stress obtained in impact type C
  • Figure 17. Course of Von Mises stress obtained in impact type D
  • Figure 18. Course of Von Mises stress obtained in impact type E