Figure 10. Optical Microscope images showing (a) Pinhole detection and measurement, Pinhole of dimension 12.1 μm × 11.5 μm with an area of 138.7 sqμm and 47.1 μm perimeter was observed. (b) Vertex view of pinhole after closer zoom

From

Etching Techniques for Thinning Silicon Wafer for Ultra Thin High Efficiency Interdigitated Back Contact Solar Cells

Iduabo John Afa, Gema López, Pablo Rafael Ortega Villasclaras

Journal of Optoelectronics Engineering. 2015, 3(1), 7-14 doi:10.12691/joe-3-1-2